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Importing a footprint with a rotated rectangular plated pad or silkscreen rectangle drops its angle. Forward
rect_ccw_rotationto the plated hole and restore silkscreen rectangle orientation throughfromCircuitJson, following the existing SolderPaste import pattern. The imported angle stays separate from immutable authored props, without expanding the public props API.Geometry checks also exposed a bottom-layer issue: decomposing a reflected placement matrix picks a different reflection axis, reversing arbitrary pad angles. Derive plated-hole orientation from the transformed local +X direction, matching SilkscreenRect and the same placement matrix used for the center.
Reproduction context: #4945 by anil08607. The two new visual regressions compare emitted rectangle corners with independently imported corner paths, including 35° local rotation, parent rotations 0/90/180/270/25°, omitted and quarter-turn local angles, nonzero local centers, both layers, and unchanged input records. Both tests fail on unchanged main; after the import-only change, the plated-pad test still fails on the bottom layer, and the placement correction resolves it.
Validation:
subcircuit-inflate-primitives(0.01%) andplated-hole-paste-rotation(0.12%). Running untouched main with the same dependencies reproduces both; their diff PNG SHA-256 hashes are identical before and after. The existing oval-pad snapshot is updated for the corrected bottom-layer orientation and an independent corner-path check; unrelated snapshots are unchanged.Developed with AI assistance; reproduction, implementation and validation were run locally.