feat: honor noSolderPaste on SMT pads and bump props

[seveibar]

Exposed test/probe pads can now use <smtpad noSolderPaste /> to omit pcb_solder_paste while keeping copper exposed. The shared paste creation check handles all six pad shapes, including polygons and pads inside footprints, on either layer. Omitted or explicit false preserves existing behavior, covered pads still emit no paste, and true takes precedence over solderPasteMargin.

Bumps @tscircuit/props and its override from ^0.0.701 to ^0.0.703, which includes tscircuit/props#938.

Fixes #4630.

Adds a labeled PCB snapshot and a 72-pad regression matrix covering all six shapes on both layers, omitted/false/true values, margin precedence, and covered pads. Assertions check the emitted paste records and preservation of copper, mask coverage, and mask margins.

Validation:

• 23 focused SMT pad, solder paste, testpoint, solder mask, and USB-C tests pass.
• tsc --noEmit, bun run build, distribution smoke tests, and formatting pass.
• All ten CI test shards pass, together with CI type checking, formatting, package preview, distribution smoke tests, and Vercel deployment.

Dependency availability: confirmed that the published @tscircuit/props@0.0.703 installs successfully; all 23 focused tests also pass against the npm release.

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Project	Deployment	Actions	Updated
tscircuit-core-benchmarks	Ready	Preview	Oct 15, 2026 3:52pm UTC

[tscircuitbot]

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PR Rating: ⭐⭐
Impact: Minor

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